Today Broadcom announced Trident 3. The companies third major release of a chip that drove the merchant silicon revolution in the data center and started the white box movie in the Cloud. With Trident 3, all of Broadcom’s data center switching ASICs now support speeds of at least 3.2 Tbps per chip.
Trident 3 is impressive, but a few things about it really caught my eye. First, Trident 3 will offer five different skus, two of which are really focused on campus switching. One could see a 48-port 2.5 Gbps switch out of the X3 version of Trident 3 next year. We believe the Trident family moving into the campus will be significant for the industry once products begin to ship.
Second, native 25 Gbps ports. Trident is the most popular of Broadcom’s ASICs, especially in the enterprise, and with Trident 3, we expect the market to quickly move away from 10 Gbps/40 Gbps products and towards 25 Gbps/100 Gbps products. This product aligns well with our forecasts for this transition which we are excited to be publishing shortly. We still don’t see a bandwidth need in most enterprises for 25 Gbps, but the ability to future proof at the customer level and the ability to consolidate skus at a vendor level will make this compelling.
Third, we see a potential for both switch vendors and customers to benefit from one family of ASICs from the campus all the way to the data center. While it is too early to know the impact of this right after the announcement, we look forward to conducting interviews over the next few months to define this impact.
It was great to catch up with old friends and make new friends at OCP this year. The show was highly successful with attendance at the Facebook and Microsoft booths so large that it was difficult to move around. On the switch side, most of the announcements were incremental to the market, but with new chips on the horizon, and a delay in 100 Gbps because of supply constraints, we see this as a temporary pause ahead of what will likely be some bigger announcements in 2018.
There were many highlights at OCP, but three things caught our eye while walking the show floor on both days.
• Microsoft’s project Olympus server is about to transition Microsoft away from High-Density servers and towards Rack servers. This is more in line with what other Tier 1 cloud providers are doing. We note the smart-NIC is still a multichip solution, one that could be further reduced in future generations. They also announced ARM based servers and joined Facebook on announcements in machine learning and AI optimized compute. We see this change in Cloud architectures as a good sign for the industry. The market is quickly moving into more use cases, which will help drive growth beyond just moving workloads away from the premise market.
• The white box vendors were in force at the show. Edgecore showed various Fixed and Modular form factors. We note that some of these boxes are modified for larger Cloud customers with the inclusion of large SSDs or memory. We have a pretty good sense of what is using these additions, but that is a topic for a more detailed report. We also saw Quanta and Delta with large presences on the show floor.
• This year we saw many software announcements around OCP. Arista announced their containerized EOS operating system (cEOS). We saw Apstra and Cumulus active at the show as well running into many other software vendors in attendance. OCP has done a good job at straddling the hardware/software boundary, but clearly the software needed to run these networks is quickly evolving as well.